MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF
A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements con...
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| creator | COSTANTINI, Sonia CARMINATI, Roberto CASTOLDI, Laura Maria GATTI, Daniela Angela Luisa CARMINATI, Marta |
| description | A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019121122A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019121122A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019121122A13</originalsourceid><addsrcrecordid>eNqNzL8KwjAQgPEuDqK-w4FrC6ZOjuf1agJNItekjqVInEQLFZ_fP_gATt_y45tnT2tIfMENU3jXMml0hrCBijtDDCcTNCBY3-G-YWiDRApROAfj4IgSDMUGBb4fa0S85ICuAosu1vixxh3gKJ64bSFoFvb1MptdhuuUVr8usnXNgXSRxnufpnE4p1t69LEtN2qnSqXKEtX2P_UCFeA6dA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF</title><source>esp@cenet</source><creator>COSTANTINI, Sonia ; CARMINATI, Roberto ; CASTOLDI, Laura Maria ; GATTI, Daniela Angela Luisa ; CARMINATI, Marta</creator><creatorcontrib>COSTANTINI, Sonia ; CARMINATI, Roberto ; CASTOLDI, Laura Maria ; GATTI, Daniela Angela Luisa ; CARMINATI, Marta</creatorcontrib><description>A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.</description><language>eng</language><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PERFORMING OPERATIONS ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TRANSPORTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190425&DB=EPODOC&CC=US&NR=2019121122A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190425&DB=EPODOC&CC=US&NR=2019121122A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>COSTANTINI, Sonia</creatorcontrib><creatorcontrib>CARMINATI, Roberto</creatorcontrib><creatorcontrib>CASTOLDI, Laura Maria</creatorcontrib><creatorcontrib>GATTI, Daniela Angela Luisa</creatorcontrib><creatorcontrib>CARMINATI, Marta</creatorcontrib><title>MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF</title><description>A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.</description><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzL8KwjAQgPEuDqK-w4FrC6ZOjuf1agJNItekjqVInEQLFZ_fP_gATt_y45tnT2tIfMENU3jXMml0hrCBijtDDCcTNCBY3-G-YWiDRApROAfj4IgSDMUGBb4fa0S85ICuAosu1vixxh3gKJ64bSFoFvb1MptdhuuUVr8usnXNgXSRxnufpnE4p1t69LEtN2qnSqXKEtX2P_UCFeA6dA</recordid><startdate>20190425</startdate><enddate>20190425</enddate><creator>COSTANTINI, Sonia</creator><creator>CARMINATI, Roberto</creator><creator>CASTOLDI, Laura Maria</creator><creator>GATTI, Daniela Angela Luisa</creator><creator>CARMINATI, Marta</creator><scope>EVB</scope></search><sort><creationdate>20190425</creationdate><title>MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF</title><author>COSTANTINI, Sonia ; CARMINATI, Roberto ; CASTOLDI, Laura Maria ; GATTI, Daniela Angela Luisa ; CARMINATI, Marta</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019121122A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>COSTANTINI, Sonia</creatorcontrib><creatorcontrib>CARMINATI, Roberto</creatorcontrib><creatorcontrib>CASTOLDI, Laura Maria</creatorcontrib><creatorcontrib>GATTI, Daniela Angela Luisa</creatorcontrib><creatorcontrib>CARMINATI, Marta</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>COSTANTINI, Sonia</au><au>CARMINATI, Roberto</au><au>CASTOLDI, Laura Maria</au><au>GATTI, Daniela Angela Luisa</au><au>CARMINATI, Marta</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF</title><date>2019-04-25</date><risdate>2019</risdate><abstract>A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
| title | MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T14%3A56%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=COSTANTINI,%20Sonia&rft.date=2019-04-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019121122A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |