RADIO-FREQUENCY ISOLATION USING POROUS SILICON

RADIO-FREQUENCY ISOLATION USING POROUS SILICON

A method for fabricating a radio-frequency device involves providing a substrate structure including a silicon handle wafer, an oxide layer formed on the silicon handle wafer, and an active silicon layer disposed on the oxide layer. The method further involves patterning and etching the active silic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WHITEFIELD, David Scott, MASON, Jerod F
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for fabricating a radio-frequency device involves providing a substrate structure including a silicon handle wafer, an oxide layer formed on the silicon handle wafer, and an active silicon layer disposed on the oxide layer. The method further involves patterning and etching the active silicon layer and the oxide layer to form a frontside opening in the active silicon layer and the oxide layer exposing a top surface of the silicon handle wafer and converting the exposed top surface of the silicon handle wafer to porous silicon