METHOD OF ELECTROPLATING METAL INTO RECESSED FEATURE AND ELECTROPLATING LAYER IN RECESSED FEATURE

A method of electroplating a metal into a recessed feature is provided, which includes: contacting a surface of the recessed feature with an electroplating solution comprising metal ions, an accelerator additive, a suppressor additive and a leveler additive, in which the recessed feature has at leas...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jangjian, Shiu-Ko, Wang, Yu-Sheng, Peng, Yu-Ren, Hung, Chi-Cheng, Wu, Jyun-Ru, NIAN, Jun-Nan
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Jangjian, Shiu-Ko
Wang, Yu-Sheng
Peng, Yu-Ren
Hung, Chi-Cheng
Wu, Jyun-Ru
NIAN, Jun-Nan
description A method of electroplating a metal into a recessed feature is provided, which includes: contacting a surface of the recessed feature with an electroplating solution comprising metal ions, an accelerator additive, a suppressor additive and a leveler additive, in which the recessed feature has at least two elongated regions and a cross region laterally between the two elongated regions, and a molar concentration ratio of the accelerator additive: the suppressor additive: the leveler additive is (8-15):(1.5-3):(0.5-2); and electroplating the metal to form an electroplating layer in the recessed feature. An electroplating layer in a recessed feature is also provided.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019109389A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019109389A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019109389A13</originalsourceid><addsrcrecordid>eNrjZEj0dQ3x8HdR8HdTcPVxdQ4J8g_wcQzx9HNXAEo4-ih4-oX4KwS5OrsGB7u6KLi5OoaEBrkqOPq5oCv3cYx0DQIqx1DMw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDAwtDQ0sjS0sHQ2NiVMFAHzPNKg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF ELECTROPLATING METAL INTO RECESSED FEATURE AND ELECTROPLATING LAYER IN RECESSED FEATURE</title><source>esp@cenet</source><creator>Jangjian, Shiu-Ko ; Wang, Yu-Sheng ; Peng, Yu-Ren ; Hung, Chi-Cheng ; Wu, Jyun-Ru ; NIAN, Jun-Nan</creator><creatorcontrib>Jangjian, Shiu-Ko ; Wang, Yu-Sheng ; Peng, Yu-Ren ; Hung, Chi-Cheng ; Wu, Jyun-Ru ; NIAN, Jun-Nan</creatorcontrib><description>A method of electroplating a metal into a recessed feature is provided, which includes: contacting a surface of the recessed feature with an electroplating solution comprising metal ions, an accelerator additive, a suppressor additive and a leveler additive, in which the recessed feature has at least two elongated regions and a cross region laterally between the two elongated regions, and a molar concentration ratio of the accelerator additive: the suppressor additive: the leveler additive is (8-15):(1.5-3):(0.5-2); and electroplating the metal to form an electroplating layer in the recessed feature. An electroplating layer in a recessed feature is also provided.</description><language>eng</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; CURRENT COLLECTORS ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; GENERATION ; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES ; LINE CONNECTORS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190411&amp;DB=EPODOC&amp;CC=US&amp;NR=2019109389A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190411&amp;DB=EPODOC&amp;CC=US&amp;NR=2019109389A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Jangjian, Shiu-Ko</creatorcontrib><creatorcontrib>Wang, Yu-Sheng</creatorcontrib><creatorcontrib>Peng, Yu-Ren</creatorcontrib><creatorcontrib>Hung, Chi-Cheng</creatorcontrib><creatorcontrib>Wu, Jyun-Ru</creatorcontrib><creatorcontrib>NIAN, Jun-Nan</creatorcontrib><title>METHOD OF ELECTROPLATING METAL INTO RECESSED FEATURE AND ELECTROPLATING LAYER IN RECESSED FEATURE</title><description>A method of electroplating a metal into a recessed feature is provided, which includes: contacting a surface of the recessed feature with an electroplating solution comprising metal ions, an accelerator additive, a suppressor additive and a leveler additive, in which the recessed feature has at least two elongated regions and a cross region laterally between the two elongated regions, and a molar concentration ratio of the accelerator additive: the suppressor additive: the leveler additive is (8-15):(1.5-3):(0.5-2); and electroplating the metal to form an electroplating layer in the recessed feature. An electroplating layer in a recessed feature is also provided.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>GENERATION</subject><subject>INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj0dQ3x8HdR8HdTcPVxdQ4J8g_wcQzx9HNXAEo4-ih4-oX4KwS5OrsGB7u6KLi5OoaEBrkqOPq5oCv3cYx0DQIqx1DMw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDAwtDQ0sjS0sHQ2NiVMFAHzPNKg</recordid><startdate>20190411</startdate><enddate>20190411</enddate><creator>Jangjian, Shiu-Ko</creator><creator>Wang, Yu-Sheng</creator><creator>Peng, Yu-Ren</creator><creator>Hung, Chi-Cheng</creator><creator>Wu, Jyun-Ru</creator><creator>NIAN, Jun-Nan</creator><scope>EVB</scope></search><sort><creationdate>20190411</creationdate><title>METHOD OF ELECTROPLATING METAL INTO RECESSED FEATURE AND ELECTROPLATING LAYER IN RECESSED FEATURE</title><author>Jangjian, Shiu-Ko ; Wang, Yu-Sheng ; Peng, Yu-Ren ; Hung, Chi-Cheng ; Wu, Jyun-Ru ; NIAN, Jun-Nan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019109389A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>GENERATION</topic><topic>INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>Jangjian, Shiu-Ko</creatorcontrib><creatorcontrib>Wang, Yu-Sheng</creatorcontrib><creatorcontrib>Peng, Yu-Ren</creatorcontrib><creatorcontrib>Hung, Chi-Cheng</creatorcontrib><creatorcontrib>Wu, Jyun-Ru</creatorcontrib><creatorcontrib>NIAN, Jun-Nan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jangjian, Shiu-Ko</au><au>Wang, Yu-Sheng</au><au>Peng, Yu-Ren</au><au>Hung, Chi-Cheng</au><au>Wu, Jyun-Ru</au><au>NIAN, Jun-Nan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF ELECTROPLATING METAL INTO RECESSED FEATURE AND ELECTROPLATING LAYER IN RECESSED FEATURE</title><date>2019-04-11</date><risdate>2019</risdate><abstract>A method of electroplating a metal into a recessed feature is provided, which includes: contacting a surface of the recessed feature with an electroplating solution comprising metal ions, an accelerator additive, a suppressor additive and a leveler additive, in which the recessed feature has at least two elongated regions and a cross region laterally between the two elongated regions, and a molar concentration ratio of the accelerator additive: the suppressor additive: the leveler additive is (8-15):(1.5-3):(0.5-2); and electroplating the metal to form an electroplating layer in the recessed feature. An electroplating layer in a recessed feature is also provided.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2019109389A1
source esp@cenet
subjects APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CURRENT COLLECTORS
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
GENERATION
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES
LINE CONNECTORS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title METHOD OF ELECTROPLATING METAL INTO RECESSED FEATURE AND ELECTROPLATING LAYER IN RECESSED FEATURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T20%3A36%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Jangjian,%20Shiu-Ko&rft.date=2019-04-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019109389A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true