Edge Bend for Isolation Packages

Edge Bend for Isolation Packages

In one instance, a semiconductor isolation package includes a leadframe that includes a plurality of leadframe leads. At least one of the plurality of leadframe leads includes a lead body having a first end that comprises an external pin portion and a second end. The lead body has a leg portion coup...

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Hauptverfasser: Tellkamp, John Paul, Ko, Chang-Yen
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Tellkamp, John Paul
Ko, Chang-Yen
description In one instance, a semiconductor isolation package includes a leadframe that includes a plurality of leadframe leads. At least one of the plurality of leadframe leads includes a lead body having a first end that comprises an external pin portion and a second end. The lead body has a leg portion coupled to a central lead portion that is coupled to an edge bend portion. The edge bend portion is formed by a first bend on the lead body proximate the second end between the central lead portion and edge bend portion. The first bend is in the direction of the first end on the leg portion. The edge bend assists in shielding electronic fields. Other aspects are presented.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Edge Bend for Isolation Packages
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