SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device includes a base, a semiconductor element mounted on the base, a porous metal sintered body and a sealing member. The porous metal sintered body is provided on the base in an area different from an area on which the semiconductor element is mounted. The sealing member covers th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUNIMUNE, Teppei, KURAMOTO, Masafumi
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor device includes a base, a semiconductor element mounted on the base, a porous metal sintered body and a sealing member. The porous metal sintered body is provided on the base in an area different from an area on which the semiconductor element is mounted. The sealing member covers the semiconductor element. The sealing member is placed inside the porous metal sintered body.