INTERCONNECT FRAMES FOR SIP MODULES
Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.
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| creator | Hoang, Lan H Katahira, Takayoshi Chaware, Raghunandan R Liu, Chang |
| description | Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other. |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CURRENT COLLECTORS DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | INTERCONNECT FRAMES FOR SIP MODULES |
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