METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE

A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a soli...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KODAIRA, Yoshihiro, ONISHI, Kazunaga, SOUTOME, Masayuki, SANO, Shinji
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KODAIRA, Yoshihiro
ONISHI, Kazunaga
SOUTOME, Masayuki
SANO, Shinji
description A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019081020A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019081020A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019081020A13</originalsourceid><addsrcrecordid>eNrjZCjydQ3x8HdRcPMPUggI8ncJdfb0c1fwdfV1cg0CCwa7-no6-_sBJUKAPBfXME9nVwVHPxesEjpgGQK6eRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGhpYGFoYGRgaOhMXGqAA1JOQs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KODAIRA, Yoshihiro ; ONISHI, Kazunaga ; SOUTOME, Masayuki ; SANO, Shinji</creator><creatorcontrib>KODAIRA, Yoshihiro ; ONISHI, Kazunaga ; SOUTOME, Masayuki ; SANO, Shinji</creatorcontrib><description>A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190314&amp;DB=EPODOC&amp;CC=US&amp;NR=2019081020A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190314&amp;DB=EPODOC&amp;CC=US&amp;NR=2019081020A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KODAIRA, Yoshihiro</creatorcontrib><creatorcontrib>ONISHI, Kazunaga</creatorcontrib><creatorcontrib>SOUTOME, Masayuki</creatorcontrib><creatorcontrib>SANO, Shinji</creatorcontrib><title>METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE</title><description>A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCjydQ3x8HdRcPMPUggI8ncJdfb0c1fwdfV1cg0CCwa7-no6-_sBJUKAPBfXME9nVwVHPxesEjpgGQK6eRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGhpYGFoYGRgaOhMXGqAA1JOQs</recordid><startdate>20190314</startdate><enddate>20190314</enddate><creator>KODAIRA, Yoshihiro</creator><creator>ONISHI, Kazunaga</creator><creator>SOUTOME, Masayuki</creator><creator>SANO, Shinji</creator><scope>EVB</scope></search><sort><creationdate>20190314</creationdate><title>METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE</title><author>KODAIRA, Yoshihiro ; ONISHI, Kazunaga ; SOUTOME, Masayuki ; SANO, Shinji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019081020A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KODAIRA, Yoshihiro</creatorcontrib><creatorcontrib>ONISHI, Kazunaga</creatorcontrib><creatorcontrib>SOUTOME, Masayuki</creatorcontrib><creatorcontrib>SANO, Shinji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KODAIRA, Yoshihiro</au><au>ONISHI, Kazunaga</au><au>SOUTOME, Masayuki</au><au>SANO, Shinji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE</title><date>2019-03-14</date><risdate>2019</risdate><abstract>A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2019081020A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T04%3A18%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KODAIRA,%20Yoshihiro&rft.date=2019-03-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019081020A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true