PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS

An embodiment includes an apparatus comprising: a first device layer included in a top edge of a semiconductor substrate; metal layers, on the first device layer, including first and second metal layers; a second device layer on the metal layers; and additional metal layers on the second device laye...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mueller, Brennen K, Morrow, Patrick, Fischer, Paul B, Jun, Kimin
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An embodiment includes an apparatus comprising: a first device layer included in a top edge of a semiconductor substrate; metal layers, on the first device layer, including first and second metal layers; a second device layer on the metal layers; and additional metal layers on the second device layer; wherein the second device layer is not included in any semiconductor substrate. Other embodiments are described herein.