METHOD FOR FABRICATING ELECTRONIC PACKAGE

An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lai, Chieh-Lung, Lu, Chang-Lun, Chen, Lu-Yi, Li, Hung-Yuan, Peng, Shih-Liang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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