SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING

An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a moun...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ng, Chee Yang, Lee, Swee Kah, Chiang, Chau Fatt, Chua, Kok Yau, Chan, Sook Woon
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING TRANSPORTING
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