HOLLOW CATHODE DISCHARGE (HCD) SUPPRESSING CAPACITIVELY COUPLED PLASMA ELECTRODE AND GAS DISTRIBUTION FACEPLATE

A faceplate for a gas distribution system of a plasma processing chamber includes a faceplate body having a first surface, a second surface opposite to the first surface and a side surface. A first plurality of holes in the faceplate body extends from the first surface to the second surface. At leas...

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Bibliographische Detailangaben
Hauptverfasser:	Tucker, Jeremy, Augustyniak, Edward
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A faceplate for a gas distribution system of a plasma processing chamber includes a faceplate body having a first surface, a second surface opposite to the first surface and a side surface. A first plurality of holes in the faceplate body extends from the first surface to the second surface. At least some of the first plurality of holes has a first size dimension and a second size dimension in a plane parallel to the first surface. The first size dimension is transverse to the second size dimension. The first size dimension is less than 3 plasma sheath thicknesses of plasma generated by the plasma processing chamber. The second size dimension is greater than 2 times the first size dimension.