Method for Handling a Product Substrate and a Bonded Substrate System

A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhes...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Meyer-Berg, Georg, Schmidt, Tobias, Porwol, Daniel, Bauer, Michael, Doepke, Holger, von Waechter, Claus, Maier, Dominic
Format: Patent
Sprache:eng
Schlagworte:
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