REAL TIME MONITORING WITH CLOSED LOOP CHUCKING FORCE CONTROL

REAL TIME MONITORING WITH CLOSED LOOP CHUCKING FORCE CONTROL

Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamb...

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Hauptverfasser: MAKHRATCHEV, Konstantin, THACH, Senh, ONO, Masanori, BUSCHE, Matthew James, BOYD, JR., Wendell Glenn, PARKHE, Vijay D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MAKHRATCHEV, Konstantin
THACH, Senh
ONO, Masanori
BUSCHE, Matthew James
BOYD, JR., Wendell Glenn
PARKHE, Vijay D
description Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamber. A deflection force is monitored on the workpiece. A chucking voltage is applied at a minimum value. A backside gas pressure is applied at a minimum pressure. The chucking voltage and or backside gas pressure is adjusted such that the deflection force is less than a threshold value. And the chucking voltage and the backside gas pressure are simultaneously ramped up.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title REAL TIME MONITORING WITH CLOSED LOOP CHUCKING FORCE CONTROL
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