IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF

An image pickup module includes a frame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Eac...

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1. Verfasser: Chang, Jui-Hsin
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creator Chang, Jui-Hsin
description An image pickup module includes a frame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Each of the image pickup devices is adhered to an inner edge of one of the image pickup openings through one of the affixing gel layers, so as to affix the image pickup devices to the frame. A manufacture method of an image pickup module is also provided.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018309911A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018309911A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018309911A13</originalsourceid><addsrcrecordid>eNrjZLDw9HV0d1UI8HT2Dg1Q8PV3CfVxVXD0c1EI8XBV8HX0C3VzdA4JDfL0c1fwdQ3x8AdLBLn6u_EwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQwtjA0tLQ0NHQ2PiVAEA7ropQg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>Chang, Jui-Hsin</creator><creatorcontrib>Chang, Jui-Hsin</creatorcontrib><description>An image pickup module includes a frame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Each of the image pickup devices is adhered to an inner edge of one of the image pickup openings through one of the affixing gel layers, so as to affix the image pickup devices to the frame. A manufacture method of an image pickup module is also provided.</description><language>eng</language><subject>ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181025&amp;DB=EPODOC&amp;CC=US&amp;NR=2018309911A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181025&amp;DB=EPODOC&amp;CC=US&amp;NR=2018309911A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chang, Jui-Hsin</creatorcontrib><title>IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF</title><description>An image pickup module includes a frame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Each of the image pickup devices is adhered to an inner edge of one of the image pickup openings through one of the affixing gel layers, so as to affix the image pickup devices to the frame. A manufacture method of an image pickup module is also provided.</description><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDw9HV0d1UI8HT2Dg1Q8PV3CfVxVXD0c1EI8XBV8HX0C3VzdA4JDfL0c1fwdQ3x8AdLBLn6u_EwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQwtjA0tLQ0NHQ2PiVAEA7ropQg</recordid><startdate>20181025</startdate><enddate>20181025</enddate><creator>Chang, Jui-Hsin</creator><scope>EVB</scope></search><sort><creationdate>20181025</creationdate><title>IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF</title><author>Chang, Jui-Hsin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018309911A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><toplevel>online_resources</toplevel><creatorcontrib>Chang, Jui-Hsin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chang, Jui-Hsin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF</title><date>2018-10-25</date><risdate>2018</risdate><abstract>An image pickup module includes a frame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Each of the image pickup devices is adhered to an inner edge of one of the image pickup openings through one of the affixing gel layers, so as to affix the image pickup devices to the frame. A manufacture method of an image pickup module is also provided.</abstract><oa>free_for_read</oa></addata></record>
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subjects ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
title IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T21%3A14%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chang,%20Jui-Hsin&rft.date=2018-10-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2018309911A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true