METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION
Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate p...
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| creator | TODA, Hisayuki KIMIZUKA, Ryoichi TAKAYA, Yasuko EDA, Tetsuro KISHIMOTO, Kazuki |
| description | Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018298515A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018298515A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018298515A13</originalsourceid><addsrcrecordid>eNrjZDD2dQ3x8HdRcPMPUvB19HN09_RzV3D2DwhwDVIIDvVxcwxxVQjwcQwBCQf7-4SGePr78TCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwNDCyNLC1NDU0dDY-JUAQBDoCgz</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION</title><source>esp@cenet</source><creator>TODA, Hisayuki ; KIMIZUKA, Ryoichi ; TAKAYA, Yasuko ; EDA, Tetsuro ; KISHIMOTO, Kazuki</creator><creatorcontrib>TODA, Hisayuki ; KIMIZUKA, Ryoichi ; TAKAYA, Yasuko ; EDA, Tetsuro ; KISHIMOTO, Kazuki</creatorcontrib><description>Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; METALLURGY ; PHYSICS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TESTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181018&DB=EPODOC&CC=US&NR=2018298515A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181018&DB=EPODOC&CC=US&NR=2018298515A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TODA, Hisayuki</creatorcontrib><creatorcontrib>KIMIZUKA, Ryoichi</creatorcontrib><creatorcontrib>TAKAYA, Yasuko</creatorcontrib><creatorcontrib>EDA, Tetsuro</creatorcontrib><creatorcontrib>KISHIMOTO, Kazuki</creatorcontrib><title>METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION</title><description>Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>METALLURGY</subject><subject>PHYSICS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2dQ3x8HdRcPMPUvB19HN09_RzV3D2DwhwDVIIDvVxcwxxVQjwcQwBCQf7-4SGePr78TCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwNDCyNLC1NDU0dDY-JUAQBDoCgz</recordid><startdate>20181018</startdate><enddate>20181018</enddate><creator>TODA, Hisayuki</creator><creator>KIMIZUKA, Ryoichi</creator><creator>TAKAYA, Yasuko</creator><creator>EDA, Tetsuro</creator><creator>KISHIMOTO, Kazuki</creator><scope>EVB</scope></search><sort><creationdate>20181018</creationdate><title>METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION</title><author>TODA, Hisayuki ; KIMIZUKA, Ryoichi ; TAKAYA, Yasuko ; EDA, Tetsuro ; KISHIMOTO, Kazuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018298515A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>METALLURGY</topic><topic>PHYSICS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TODA, Hisayuki</creatorcontrib><creatorcontrib>KIMIZUKA, Ryoichi</creatorcontrib><creatorcontrib>TAKAYA, Yasuko</creatorcontrib><creatorcontrib>EDA, Tetsuro</creatorcontrib><creatorcontrib>KISHIMOTO, Kazuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TODA, Hisayuki</au><au>KIMIZUKA, Ryoichi</au><au>TAKAYA, Yasuko</au><au>EDA, Tetsuro</au><au>KISHIMOTO, Kazuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION</title><date>2018-10-18</date><risdate>2018</risdate><abstract>Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TESTING |
| title | METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION |
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