INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Dinh, Richard Hung Minh, Tan, Tang Yew, Tan, Lee Hua, Lynch, Stephen Brian, Pakula, David
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CARRIED BAGS HAND OR TRAVELLING ARTICLES HUMAN NECESSITIES LUGGAGE MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS PURSES TELEPHONIC COMMUNICATION TRAVELLING OR CAMP EQUIPMENT: SACKS OR PACKS CARRIED ON THEBODY
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Beschreibung
Zusammenfassung:	An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.