PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF MANUFACTURE THEREOF

An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conducti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SANCHEZ, Audel A, VISWANATHAN, Lakshminarayan, WHITE, Jerry L, SANTOS, Fernando A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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