LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD

One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.

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1. Verfasser:	ENDO, Mitsuteru
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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container_start_page
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container_volume
creator	ENDO, Mitsuteru
description	One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018264779A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018264779A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018264779A13</originalsourceid><addsrcrecordid>eNrjZHD3cfT19HMMcdVR8HUN8fB3UXDzD1IICPJ3CXX29HNXCHb0BUo5-gHFfVwjPJ18XIGSnn4hri4Kzp5BzqGeIQpO_o5BLjwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JD402MjA0MLIzMTc3NLR0Jg4VQBTNC0p</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>ENDO, Mitsuteru</creator><creatorcontrib>ENDO, Mitsuteru</creatorcontrib><description>One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180920&DB=EPODOC&CC=US&NR=2018264779A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180920&DB=EPODOC&CC=US&NR=2018264779A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ENDO, Mitsuteru</creatorcontrib><title>LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD</title><description>One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3cfT19HMMcdVR8HUN8fB3UXDzD1IICPJ3CXX29HNXCHb0BUo5-gHFfVwjPJ18XIGSnn4hri4Kzp5BzqGeIQpO_o5BLjwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JD402MjA0MLIzMTc3NLR0Jg4VQBTNC0p</recordid><startdate>20180920</startdate><enddate>20180920</enddate><creator>ENDO, Mitsuteru</creator><scope>EVB</scope></search><sort><creationdate>20180920</creationdate><title>LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD</title><author>ENDO, Mitsuteru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018264779A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ENDO, Mitsuteru</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ENDO, Mitsuteru</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD</title><date>2018-09-20</date><risdate>2018</risdate><abstract>One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US2018264779A1
source	esp@cenet
subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
title	LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T01%3A42%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ENDO,%20Mitsuteru&rft.date=2018-09-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2018264779A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true