CONDUCTIVE FILM
A conductive film includes a film substrate and a conductive material layer. The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed...
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| creator | YABU, Hiroshi ITO, Koju NAGAMINE, Kuniaki NISHIZAWA, Matsuhiko KOHASHI, Souichi |
| description | A conductive film includes a film substrate and a conductive material layer. The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed in the conductive film. The conductive material layer has a plurality of conductive portions, and the conductive portions are present between adjacent layer opening portions. The number of the conductive portion is 400 per 1 mm2, and an opening ratio of the conductive material layer is at least 40%. |
| format | Patent |
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The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed in the conductive film. The conductive material layer has a plurality of conductive portions, and the conductive portions are present between adjacent layer opening portions. The number of the conductive portion is 400 per 1 mm2, and an opening ratio of the conductive material layer is at least 40%.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180913&DB=EPODOC&CC=US&NR=2018257336A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180913&DB=EPODOC&CC=US&NR=2018257336A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YABU, Hiroshi</creatorcontrib><creatorcontrib>ITO, Koju</creatorcontrib><creatorcontrib>NAGAMINE, Kuniaki</creatorcontrib><creatorcontrib>NISHIZAWA, Matsuhiko</creatorcontrib><creatorcontrib>KOHASHI, Souichi</creatorcontrib><title>CONDUCTIVE FILM</title><description>A conductive film includes a film substrate and a conductive material layer. 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The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed in the conductive film. The conductive material layer has a plurality of conductive portions, and the conductive portions are present between adjacent layer opening portions. The number of the conductive portion is 400 per 1 mm2, and an opening ratio of the conductive material layer is at least 40%.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | CONDUCTIVE FILM |
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