INSPECTION METHOD AND INSPECTION APPARATUS
A high resolution optical image is acquired by irradiating a mask with light emitted by a light source via a high resolution optical system. A low resolution optical image is acquired by irradiating the same mask with the light via a low resolution optical system. The design data of the mask pattern...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Kikuiri, Nobutaka Inoue, Hiromu |
description | A high resolution optical image is acquired by irradiating a mask with light emitted by a light source via a high resolution optical system. A low resolution optical image is acquired by irradiating the same mask with the light via a low resolution optical system. The design data of the mask pattern is corrected in light of shapes and dimensions determined according to at least one of a manufacturing process of the mask and a manufacturing process of a semiconductor device to be manufactured by transferring the mask pattern to a semiconductor wafer. Reference image data are generated corresponding to the high resolution optical image and the low resolution optical image. Whether the defect detected in the high resolution optical image is true or false is determined according to information of the defect detected in the low resolution optical image. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018232873A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018232873A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018232873A13</originalsourceid><addsrcrecordid>eNrjZNDy9AsOcHUO8fT3U_B1DfHwd1Fw9HNRQBJ1DAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYWRsZGFubGjobGxKkCAPelJco</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INSPECTION METHOD AND INSPECTION APPARATUS</title><source>esp@cenet</source><creator>Kikuiri, Nobutaka ; Inoue, Hiromu</creator><creatorcontrib>Kikuiri, Nobutaka ; Inoue, Hiromu</creatorcontrib><description>A high resolution optical image is acquired by irradiating a mask with light emitted by a light source via a high resolution optical system. A low resolution optical image is acquired by irradiating the same mask with the light via a low resolution optical system. The design data of the mask pattern is corrected in light of shapes and dimensions determined according to at least one of a manufacturing process of the mask and a manufacturing process of a semiconductor device to be manufactured by transferring the mask pattern to a semiconductor wafer. Reference image data are generated corresponding to the high resolution optical image and the low resolution optical image. Whether the defect detected in the high resolution optical image is true or false is determined according to information of the defect detected in the low resolution optical image.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CALCULATING ; CINEMATOGRAPHY ; COMPUTING ; COUNTING ; ELECTROGRAPHY ; HOLOGRAPHY ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; TESTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180816&DB=EPODOC&CC=US&NR=2018232873A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180816&DB=EPODOC&CC=US&NR=2018232873A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kikuiri, Nobutaka</creatorcontrib><creatorcontrib>Inoue, Hiromu</creatorcontrib><title>INSPECTION METHOD AND INSPECTION APPARATUS</title><description>A high resolution optical image is acquired by irradiating a mask with light emitted by a light source via a high resolution optical system. A low resolution optical image is acquired by irradiating the same mask with the light via a low resolution optical system. The design data of the mask pattern is corrected in light of shapes and dimensions determined according to at least one of a manufacturing process of the mask and a manufacturing process of a semiconductor device to be manufactured by transferring the mask pattern to a semiconductor wafer. Reference image data are generated corresponding to the high resolution optical image and the low resolution optical image. Whether the defect detected in the high resolution optical image is true or false is determined according to information of the defect detected in the low resolution optical image.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CALCULATING</subject><subject>CINEMATOGRAPHY</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDy9AsOcHUO8fT3U_B1DfHwd1Fw9HNRQBJ1DAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYWRsZGFubGjobGxKkCAPelJco</recordid><startdate>20180816</startdate><enddate>20180816</enddate><creator>Kikuiri, Nobutaka</creator><creator>Inoue, Hiromu</creator><scope>EVB</scope></search><sort><creationdate>20180816</creationdate><title>INSPECTION METHOD AND INSPECTION APPARATUS</title><author>Kikuiri, Nobutaka ; Inoue, Hiromu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018232873A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CALCULATING</topic><topic>CINEMATOGRAPHY</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Kikuiri, Nobutaka</creatorcontrib><creatorcontrib>Inoue, Hiromu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kikuiri, Nobutaka</au><au>Inoue, Hiromu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INSPECTION METHOD AND INSPECTION APPARATUS</title><date>2018-08-16</date><risdate>2018</risdate><abstract>A high resolution optical image is acquired by irradiating a mask with light emitted by a light source via a high resolution optical system. A low resolution optical image is acquired by irradiating the same mask with the light via a low resolution optical system. The design data of the mask pattern is corrected in light of shapes and dimensions determined according to at least one of a manufacturing process of the mask and a manufacturing process of a semiconductor device to be manufactured by transferring the mask pattern to a semiconductor wafer. Reference image data are generated corresponding to the high resolution optical image and the low resolution optical image. Whether the defect detected in the high resolution optical image is true or false is determined according to information of the defect detected in the low resolution optical image.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2018232873A1 |
source | esp@cenet |
subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTROGRAPHY HOLOGRAPHY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING |
title | INSPECTION METHOD AND INSPECTION APPARATUS |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T19%3A24%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kikuiri,%20Nobutaka&rft.date=2018-08-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2018232873A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |