Wafer pin chuck fabrication and repair

In a wafer chuck design featuring pins or "mesas" making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits, minimizes sticking of the wafer, and improves wafer settling. In another aspect of the invention is a tool and method for imparting o...

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Bibliographische Detailangaben
1. Verfasser:	Gratrix, Edward J
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HOLOGRAPHY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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