DIRECT BONDING METHOD

The method is carried out of a first substrate having a first layer made of a first material with a second substrate having a second layer made of a second material, the first material and the second material being of different natures and selected from alloys of elements of columns III and V, the m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAUZIN, Aurélie, IMBERT, Bruno
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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