HIGH-FREQUENCY MODULE

A high-frequency module includes a wiring substrate and an antenna substrate disposed on an upper surface of the wiring substrate, an antenna is formed by a metal pattern on the antenna substrate, a non-conductive adhesive and a conductive adhesive are disposed between the wiring substrate and the a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Nakagawa, Masashi, Shibuya, Yoshihisa, Kuwana, Shunji, Watanabe, Hideki, Seike, Takehiro
Format: Patent
Sprache:eng
Schlagworte:
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