FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, at least one component-embedded substrate disposed adjacent the semiconductor chip in the through-hole and spaced apart from the semiconductor chip by a predet...

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Hauptverfasser: CHO, Jung Hyun, KIM, Byoung Chan, YI, Moon Hee, BAEK, Yong Ho
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHO, Jung Hyun
KIM, Byoung Chan
YI, Moon Hee
BAEK, Yong Ho
description A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, at least one component-embedded substrate disposed adjacent the semiconductor chip in the through-hole and spaced apart from the semiconductor chip by a predetermined distance and having a plurality of passive components embedded therein, an encapsulant encapsulating at least portions of the first connection member, the at least one component-embedded substrate, and the semiconductor chip, and a second connection member disposed on the first connection member, the at least one component-embedded substrate, and the semiconductor chip. The first and second connection members each include redistribution layers electrically connected to the connection pads of the semiconductor chip, and the plurality of passive components embedded in the at least one component-embedded substrate are electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title FAN-OUT SEMICONDUCTOR PACKAGE
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