LED Flip-Chip Structure

An LED flip-chip structure is provided, wherein a silica gel, a fluorescent glue, a lens, an anti-reflection film and a packaging adhesive layer is sequentially arranged on the LED chip. The silica gel and fluorescent glue are sequentially filled within an insulating reflective cup, outside which a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zhou, Junnan, Yang, Sipan, Xiong, Deping, He, Miao
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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