High Density Tec-Cell Carrier

The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficien...

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Hauptverfasser: Wohanka, Christian, Fenner, Yves, Fiddes, John, Dovids, Gerhard, Rahrbach, Bernd
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Sprache:eng
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creator Wohanka, Christian
Fenner, Yves
Fiddes, John
Dovids, Gerhard
Rahrbach, Bernd
description The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficiency and other abilities such as increased cleanliness and reduced contamination to wafers during handling, storage or processing as well as higher density storage and better stocking, storage and handling abilities.
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subjects BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
TRANSPORTING
title High Density Tec-Cell Carrier
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