Under Screen Sensor Assembly

A sensor assembly that includes a silicon substrate and a sensor integrally formed on or in its top surface. Bond pads are formed at the substrate top surface and electrically coupled to the sensor. A trench is formed into the top surface, extending toward but not reaching the substrate's botto...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Oganesian, Vage
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS
Online-Zugang:	Volltext bestellen
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