INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS

A structure having fully aligned via connecting metal lines on different Mx levels. The structure may include a first metal line and a second metal line in a first ILD, a cap covering the first ILD, the second metal line and a portion of the first metal line, a second ILD on the cap, and a via that...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Huang Elbert E, Nitta Satyanarayana V, Edelstein Daniel C, Fuller Nicholas C, Rath David L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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