ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tsai Chi-Pin, Lin Tsung-Li, Chu Heng-Cheng, Tsai Ming-Fan, Shih Chih-Yuan, Tsai Tsung-Hsien, Chiu Chih-Hsien, Lin Chien-Cheng, Chang Yueh-Chiung
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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