FAN-OUT SEMICONDUCTOR PACKAGE

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an enc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YI Moon Hee, CHUNG Yul Kyo, JUNG Joo Hwan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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