SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACTURING METHOD OF THE SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

A semiconductor integrated circuit device includes a component built-in board in which at least a first core layer on which a first electronic component is mounted, a second core layer on which a second electronic component is mounted, an adhesive layer arranged between the first core layer and the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BETSUI Takafumi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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