SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE
A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers,...
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| creator | CHEN Hua QIU Yuqun PAN Zhanhua LI Minhua ZHANG Xuewei XIE Chunhui OUYANG Ti |
| description | A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018042140A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018042140A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018042140A13</originalsourceid><addsrcrecordid>eNqNjLsKwkAQRdNYiPoPA9ZCNqawHTcTd0iyi_uIpgpB1ko0EP8fBS0srS6cc7jzJDqyLVmwKCtQhB4c6wpc5zw1cGKvQJpmzxo9Gw2mhJqPgYs3NTXrAxTUsiRAXQCGM9eMtvs5-uhlMrsOtymuvrtI1iV5qTZxfPRxGodLvMdnH1yWil2aZyJPUWz_q14wljVZ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE</title><source>esp@cenet</source><creator>CHEN Hua ; QIU Yuqun ; PAN Zhanhua ; LI Minhua ; ZHANG Xuewei ; XIE Chunhui ; OUYANG Ti</creator><creatorcontrib>CHEN Hua ; QIU Yuqun ; PAN Zhanhua ; LI Minhua ; ZHANG Xuewei ; XIE Chunhui ; OUYANG Ti</creatorcontrib><description>A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180208&DB=EPODOC&CC=US&NR=2018042140A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180208&DB=EPODOC&CC=US&NR=2018042140A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN Hua</creatorcontrib><creatorcontrib>QIU Yuqun</creatorcontrib><creatorcontrib>PAN Zhanhua</creatorcontrib><creatorcontrib>LI Minhua</creatorcontrib><creatorcontrib>ZHANG Xuewei</creatorcontrib><creatorcontrib>XIE Chunhui</creatorcontrib><creatorcontrib>OUYANG Ti</creatorcontrib><title>SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE</title><description>A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKwkAQRdNYiPoPA9ZCNqawHTcTd0iyi_uIpgpB1ko0EP8fBS0srS6cc7jzJDqyLVmwKCtQhB4c6wpc5zw1cGKvQJpmzxo9Gw2mhJqPgYs3NTXrAxTUsiRAXQCGM9eMtvs5-uhlMrsOtymuvrtI1iV5qTZxfPRxGodLvMdnH1yWil2aZyJPUWz_q14wljVZ</recordid><startdate>20180208</startdate><enddate>20180208</enddate><creator>CHEN Hua</creator><creator>QIU Yuqun</creator><creator>PAN Zhanhua</creator><creator>LI Minhua</creator><creator>ZHANG Xuewei</creator><creator>XIE Chunhui</creator><creator>OUYANG Ti</creator><scope>EVB</scope></search><sort><creationdate>20180208</creationdate><title>SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE</title><author>CHEN Hua ; QIU Yuqun ; PAN Zhanhua ; LI Minhua ; ZHANG Xuewei ; XIE Chunhui ; OUYANG Ti</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018042140A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN Hua</creatorcontrib><creatorcontrib>QIU Yuqun</creatorcontrib><creatorcontrib>PAN Zhanhua</creatorcontrib><creatorcontrib>LI Minhua</creatorcontrib><creatorcontrib>ZHANG Xuewei</creatorcontrib><creatorcontrib>XIE Chunhui</creatorcontrib><creatorcontrib>OUYANG Ti</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN Hua</au><au>QIU Yuqun</au><au>PAN Zhanhua</au><au>LI Minhua</au><au>ZHANG Xuewei</au><au>XIE Chunhui</au><au>OUYANG Ti</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE</title><date>2018-02-08</date><risdate>2018</risdate><abstract>A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
| title | SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE |
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