HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME

A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lee Byungsu, Park Jongkil, Jung Jeeyoung, Lee Jiwoo, KIM Kyuwon
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Lee Byungsu
Park Jongkil
Jung Jeeyoung
Lee Jiwoo
KIM Kyuwon
description A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018035528A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018035528A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018035528A13</originalsourceid><addsrcrecordid>eNqNyr0KwjAQAOAsDqK-w4FzoT8Uuh6X0xzUNDQX11IkTkUL9f1x8QGcvuXbG3KMClZilIAqgwcMAUfUFAG9Be6ZdBy8EFi-CzGIpz5Z8VdQxxDxxkeze87Llk8_D-Z8YSVX5PU95W2dH_mVP1OKdVl1ZdO2dYdV89_6As6xLEs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME</title><source>esp@cenet</source><creator>Lee Byungsu ; Park Jongkil ; Jung Jeeyoung ; Lee Jiwoo ; KIM Kyuwon</creator><creatorcontrib>Lee Byungsu ; Park Jongkil ; Jung Jeeyoung ; Lee Jiwoo ; KIM Kyuwon</creatorcontrib><description>A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SYSTEMS FOR STORING ELECTRIC ENERGY</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180201&amp;DB=EPODOC&amp;CC=US&amp;NR=2018035528A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180201&amp;DB=EPODOC&amp;CC=US&amp;NR=2018035528A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee Byungsu</creatorcontrib><creatorcontrib>Park Jongkil</creatorcontrib><creatorcontrib>Jung Jeeyoung</creatorcontrib><creatorcontrib>Lee Jiwoo</creatorcontrib><creatorcontrib>KIM Kyuwon</creatorcontrib><title>HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME</title><description>A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SYSTEMS FOR STORING ELECTRIC ENERGY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAQAOAsDqK-w4FzoT8Uuh6X0xzUNDQX11IkTkUL9f1x8QGcvuXbG3KMClZilIAqgwcMAUfUFAG9Be6ZdBy8EFi-CzGIpz5Z8VdQxxDxxkeze87Llk8_D-Z8YSVX5PU95W2dH_mVP1OKdVl1ZdO2dYdV89_6As6xLEs</recordid><startdate>20180201</startdate><enddate>20180201</enddate><creator>Lee Byungsu</creator><creator>Park Jongkil</creator><creator>Jung Jeeyoung</creator><creator>Lee Jiwoo</creator><creator>KIM Kyuwon</creator><scope>EVB</scope></search><sort><creationdate>20180201</creationdate><title>HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME</title><author>Lee Byungsu ; Park Jongkil ; Jung Jeeyoung ; Lee Jiwoo ; KIM Kyuwon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018035528A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SYSTEMS FOR STORING ELECTRIC ENERGY</topic><toplevel>online_resources</toplevel><creatorcontrib>Lee Byungsu</creatorcontrib><creatorcontrib>Park Jongkil</creatorcontrib><creatorcontrib>Jung Jeeyoung</creatorcontrib><creatorcontrib>Lee Jiwoo</creatorcontrib><creatorcontrib>KIM Kyuwon</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee Byungsu</au><au>Park Jongkil</au><au>Jung Jeeyoung</au><au>Lee Jiwoo</au><au>KIM Kyuwon</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME</title><date>2018-02-01</date><risdate>2018</risdate><abstract>A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2018035528A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SYSTEMS FOR STORING ELECTRIC ENERGY
title HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T21%3A14%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Lee%20Byungsu&rft.date=2018-02-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2018035528A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true