Physical Layer for Peripheral Interconnect with Reduced Power and Area
An integrated circuit (IC) implements an industry standard-defined peripheral interconnect to connect to another integrated circuit or component in a system. The industry standard specification includes a software interface that is well-defined and implemented by various software in the system, and...
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creator | Dabral Sanjay Polzin R. Stephen |
description | An integrated circuit (IC) implements an industry standard-defined peripheral interconnect to connect to another integrated circuit or component in a system. The industry standard specification includes a software interface that is well-defined and implemented by various software in the system, and thus is desirable to retain. However, the physical interconnect in the systems employing the integrated circuit may be short, and thus the elaborate physical layer definition may consume more integrated circuit area and power than is otherwise desirable in the IC. The IC may implement a simpler and more power-efficient physical layer, reducing both power consumption and semiconductor substrate area consumption, in some embodiments. |
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Stephen</creatorcontrib><description>An integrated circuit (IC) implements an industry standard-defined peripheral interconnect to connect to another integrated circuit or component in a system. The industry standard specification includes a software interface that is well-defined and implemented by various software in the system, and thus is desirable to retain. However, the physical interconnect in the systems employing the integrated circuit may be short, and thus the elaborate physical layer definition may consume more integrated circuit area and power than is otherwise desirable in the IC. The IC may implement a simpler and more power-efficient physical layer, reducing both power consumption and semiconductor substrate area consumption, in some embodiments.</description><language>eng</language><subject>CALCULATING ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. 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Stephen</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Physical Layer for Peripheral Interconnect with Reduced Power and Area</title><date>2017-12-21</date><risdate>2017</risdate><abstract>An integrated circuit (IC) implements an industry standard-defined peripheral interconnect to connect to another integrated circuit or component in a system. The industry standard specification includes a software interface that is well-defined and implemented by various software in the system, and thus is desirable to retain. However, the physical interconnect in the systems employing the integrated circuit may be short, and thus the elaborate physical layer definition may consume more integrated circuit area and power than is otherwise desirable in the IC. The IC may implement a simpler and more power-efficient physical layer, reducing both power consumption and semiconductor substrate area consumption, in some embodiments.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CALCULATING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
title | Physical Layer for Peripheral Interconnect with Reduced Power and Area |
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