MAGNETIC SENSOR

MAGNETIC SENSOR

A magnetic sensor includes a semiconductor element, a lead frame, a bonding wire, and a package. The lead frame includes a die pad to which the semiconductor element is attached and an external connection lead. The bonding wire connects the external connection lead with the semiconductor element. Th...

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1. Verfasser: INUZUKA Yoshinori
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator INUZUKA Yoshinori
description A magnetic sensor includes a semiconductor element, a lead frame, a bonding wire, and a package. The lead frame includes a die pad to which the semiconductor element is attached and an external connection lead. The bonding wire connects the external connection lead with the semiconductor element. The package seals the semiconductor element, the die pad, the external connection pad, and the bonding wire. The package is made of epoxy-based resin. The lead frame further includes a projecting portion extending from the die pad, the projecting portion is exposed from the package at a position different from a position of the external connection lead, and a partial surface of the projecting portion which contacts with the package is made of material having a higher ionization tendency than an ionization tendency of silver.
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The bonding wire connects the external connection lead with the semiconductor element. The package seals the semiconductor element, the die pad, the external connection pad, and the bonding wire. The package is made of epoxy-based resin. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MAGNETIC SENSOR
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