DIE REPATTERNING TRANSMISSION LINES ON SILICON PHOTOMULTIPLIERS

A silicon photomultiplier array includes a plurality of microcells within the photomultiplier array and located on the silicon wafer, the plurality of microcells arranged in rows and columns, each of the plurality of microcells including an output port, and configured to provide a pulse waveform having pulse characteristics, at least one repatterning dielectric layer in contact with a silicon wafer layer back surface, the silicon wafer having an active surface opposed to the back surface, and a plurality of respective through-silicon-vias (TSVs) coupling the output port of respective ones of the plurality of microcells on the active surface of the silicon wafer to a plurality of respective circuit traces on the at least one repatterning dielectric layer disposed on the back surface of the silicon wafer. A method for producing the silicon photomultiplier array is also disclosed.