COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF
The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substr...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Li Cheng-Syun Lin Shih-Chieh Lo Chiung-Cheng Wu Chia-Yu |
| description | The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017328800A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017328800A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017328800A13</originalsourceid><addsrcrecordid>eNqNyr0KwjAQAOAuDqK-w4FzIW0Hu8bLxQR6CeSn4FSKxEm0UN8fHXwAp2_5thWj57MHthh8TQNh-sqERjqLcoB4jYkYFI0WCaRTwNJlLTHlYN0FmJLxCpKhQF7vq819fqzl8HNXHTUlNHVZXlNZl_lWnuU95diK5tS1fS-EbLr_1gefji8n</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>Li Cheng-Syun ; Lin Shih-Chieh ; Lo Chiung-Cheng ; Wu Chia-Yu</creator><creatorcontrib>Li Cheng-Syun ; Lin Shih-Chieh ; Lo Chiung-Cheng ; Wu Chia-Yu</creatorcontrib><description>The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.</description><language>eng</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; TESTING ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171116&DB=EPODOC&CC=US&NR=2017328800A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171116&DB=EPODOC&CC=US&NR=2017328800A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Li Cheng-Syun</creatorcontrib><creatorcontrib>Lin Shih-Chieh</creatorcontrib><creatorcontrib>Lo Chiung-Cheng</creatorcontrib><creatorcontrib>Wu Chia-Yu</creatorcontrib><title>COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF</title><description>The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAQAOAuDqK-w4FzIW0Hu8bLxQR6CeSn4FSKxEm0UN8fHXwAp2_5thWj57MHthh8TQNh-sqERjqLcoB4jYkYFI0WCaRTwNJlLTHlYN0FmJLxCpKhQF7vq819fqzl8HNXHTUlNHVZXlNZl_lWnuU95diK5tS1fS-EbLr_1gefji8n</recordid><startdate>20171116</startdate><enddate>20171116</enddate><creator>Li Cheng-Syun</creator><creator>Lin Shih-Chieh</creator><creator>Lo Chiung-Cheng</creator><creator>Wu Chia-Yu</creator><scope>EVB</scope></search><sort><creationdate>20171116</creationdate><title>COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF</title><author>Li Cheng-Syun ; Lin Shih-Chieh ; Lo Chiung-Cheng ; Wu Chia-Yu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017328800A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Li Cheng-Syun</creatorcontrib><creatorcontrib>Lin Shih-Chieh</creatorcontrib><creatorcontrib>Lo Chiung-Cheng</creatorcontrib><creatorcontrib>Wu Chia-Yu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Li Cheng-Syun</au><au>Lin Shih-Chieh</au><au>Lo Chiung-Cheng</au><au>Wu Chia-Yu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF</title><date>2017-11-16</date><risdate>2017</risdate><abstract>The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2017328800A1 |
| source | esp@cenet |
| subjects | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING |
| title | COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T14%3A12%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Li%20Cheng-Syun&rft.date=2017-11-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2017328800A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |