Electronic Component and Process of Producing Electronic Component

Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure inclu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Soneja Shallu, Leidner Michael, Freckmann Dominique, Bharadwaj Lavanya, Schmidt Helge, Mathews Barry C, Gulsoy Gokce, Sachs Soenke, Oar Michael A
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Soneja Shallu
Leidner Michael
Freckmann Dominique
Bharadwaj Lavanya
Schmidt Helge
Mathews Barry C
Gulsoy Gokce
Sachs Soenke
Oar Michael A
description Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017326841A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017326841A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017326841A13</originalsourceid><addsrcrecordid>eNrjZHByzUlNLinKz8tMVnDOzy3Iz0vNK1FIzEtRCCjKT04tLlbITwMxU0qTM_PSFbCp5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaG5sZGZhYmho6GxsSpAgAIYTMJ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic Component and Process of Producing Electronic Component</title><source>esp@cenet</source><creator>Soneja Shallu ; Leidner Michael ; Freckmann Dominique ; Bharadwaj Lavanya ; Schmidt Helge ; Mathews Barry C ; Gulsoy Gokce ; Sachs Soenke ; Oar Michael A</creator><creatorcontrib>Soneja Shallu ; Leidner Michael ; Freckmann Dominique ; Bharadwaj Lavanya ; Schmidt Helge ; Mathews Barry C ; Gulsoy Gokce ; Sachs Soenke ; Oar Michael A</creatorcontrib><description>Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171116&amp;DB=EPODOC&amp;CC=US&amp;NR=2017326841A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171116&amp;DB=EPODOC&amp;CC=US&amp;NR=2017326841A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Soneja Shallu</creatorcontrib><creatorcontrib>Leidner Michael</creatorcontrib><creatorcontrib>Freckmann Dominique</creatorcontrib><creatorcontrib>Bharadwaj Lavanya</creatorcontrib><creatorcontrib>Schmidt Helge</creatorcontrib><creatorcontrib>Mathews Barry C</creatorcontrib><creatorcontrib>Gulsoy Gokce</creatorcontrib><creatorcontrib>Sachs Soenke</creatorcontrib><creatorcontrib>Oar Michael A</creatorcontrib><title>Electronic Component and Process of Producing Electronic Component</title><description>Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHByzUlNLinKz8tMVnDOzy3Iz0vNK1FIzEtRCCjKT04tLlbITwMxU0qTM_PSFbCp5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaG5sZGZhYmho6GxsSpAgAIYTMJ</recordid><startdate>20171116</startdate><enddate>20171116</enddate><creator>Soneja Shallu</creator><creator>Leidner Michael</creator><creator>Freckmann Dominique</creator><creator>Bharadwaj Lavanya</creator><creator>Schmidt Helge</creator><creator>Mathews Barry C</creator><creator>Gulsoy Gokce</creator><creator>Sachs Soenke</creator><creator>Oar Michael A</creator><scope>EVB</scope></search><sort><creationdate>20171116</creationdate><title>Electronic Component and Process of Producing Electronic Component</title><author>Soneja Shallu ; Leidner Michael ; Freckmann Dominique ; Bharadwaj Lavanya ; Schmidt Helge ; Mathews Barry C ; Gulsoy Gokce ; Sachs Soenke ; Oar Michael A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017326841A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Soneja Shallu</creatorcontrib><creatorcontrib>Leidner Michael</creatorcontrib><creatorcontrib>Freckmann Dominique</creatorcontrib><creatorcontrib>Bharadwaj Lavanya</creatorcontrib><creatorcontrib>Schmidt Helge</creatorcontrib><creatorcontrib>Mathews Barry C</creatorcontrib><creatorcontrib>Gulsoy Gokce</creatorcontrib><creatorcontrib>Sachs Soenke</creatorcontrib><creatorcontrib>Oar Michael A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Soneja Shallu</au><au>Leidner Michael</au><au>Freckmann Dominique</au><au>Bharadwaj Lavanya</au><au>Schmidt Helge</au><au>Mathews Barry C</au><au>Gulsoy Gokce</au><au>Sachs Soenke</au><au>Oar Michael A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic Component and Process of Producing Electronic Component</title><date>2017-11-16</date><risdate>2017</risdate><abstract>Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2017326841A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
title Electronic Component and Process of Producing Electronic Component
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T02%3A57%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Soneja%20Shallu&rft.date=2017-11-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2017326841A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true