DIELECTRIC WINDOW SUPPORTING STRUCTURE FOR INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS

An Dielectric window of an inductively coupled plasma (ICP) processing apparatus that includes a main container 10 that houses a substrate to be processed S to perform plasma processing, a substrate mounting unit 20 on which the substrate to be processed S is mounted in the main container 10, an exhaust system 30 that discharges gas from inside of the main container 10, a dielectric window 100 that form an upper window of the main container 10, and one or more RF antennas 40 which are installed to correspond to the dielectric windows 100 outside the main container 10 and to which RF power is applied to form induced electric field in the main container 10, wherein the dielectric window 100 is formed as one body from one or more dielectric members, and bonded with a ceramic reinforcing member 120 to at least one surface of the upper surface and the lower surface of the dielectric window 100, including a dielectric window supporting unit 500 supporting at least one of the dielectric window 100 and the ceramic reinforcing member 120 by penetrating at least one of the dielectric window 100 and the ceramic reinforcing member 120 and being connected with a supporting member 12 installed above the main container 10, is provided, so it is possible to minimize power loss by the replacement of a dielectric supporting structure at a region where an antenna is installed, with ceramic.