DIRECT DIODE LASER PROCESSING APPARATUS AND OUTPUT MONITORING METHOD THERFOF
A direct diode laser processing apparatus includes a laser oscillator including a plurality of laser diodes and emitting a multiple-wavelength laser beam, a transmission fiber transmitting the multiple-wavelength laser beam emitted from the laser oscillator, a laser processing machine collecting the...
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| creator | OGATA Minoru |
| description | A direct diode laser processing apparatus includes a laser oscillator including a plurality of laser diodes and emitting a multiple-wavelength laser beam, a transmission fiber transmitting the multiple-wavelength laser beam emitted from the laser oscillator, a laser processing machine collecting the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece, a detecting mechanism sampling part of the multiple-wavelength laser beam and detecting wavelength-by-wavelength light intensities of the sampled laser beam, a monitoring unit monitoring an output decrease in the multiple-wavelength laser beam according to a change in the wavelength-by-wavelength light intensities, and a control module controlling outputs of the plurality of laser diodes according to a monitored result from the monitoring unit. The apparatus properly monitors an output decrease in the multiple-wavelength laser beam. |
| format | Patent |
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The apparatus properly monitors an output decrease in the multiple-wavelength laser beam.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr8KwjAQgPEsDqK-w4Gz0H8gjiG52ECbC5fLXIrESbRQ3x8RfACnb_h9WzVYz2gErCeLMOiEDJHJYEo-XEHHqFlLTqCDBcoSs8BIwQvx10eUnixIj-zI7dXmPj_Wcvh1p44OxfSnsrymsi7zrTzLe8qpqepzW3WXrtF1-9_1AY28LyU</recordid><startdate>20171026</startdate><enddate>20171026</enddate><creator>OGATA Minoru</creator><scope>EVB</scope></search><sort><creationdate>20171026</creationdate><title>DIRECT DIODE LASER PROCESSING APPARATUS AND OUTPUT MONITORING METHOD THERFOF</title><author>OGATA Minoru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017304942A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>OGATA Minoru</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGATA Minoru</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIRECT DIODE LASER PROCESSING APPARATUS AND OUTPUT MONITORING METHOD THERFOF</title><date>2017-10-26</date><risdate>2017</risdate><abstract>A direct diode laser processing apparatus includes a laser oscillator including a plurality of laser diodes and emitting a multiple-wavelength laser beam, a transmission fiber transmitting the multiple-wavelength laser beam emitted from the laser oscillator, a laser processing machine collecting the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece, a detecting mechanism sampling part of the multiple-wavelength laser beam and detecting wavelength-by-wavelength light intensities of the sampled laser beam, a monitoring unit monitoring an output decrease in the multiple-wavelength laser beam according to a change in the wavelength-by-wavelength light intensities, and a control module controlling outputs of the plurality of laser diodes according to a monitored result from the monitoring unit. 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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | DIRECT DIODE LASER PROCESSING APPARATUS AND OUTPUT MONITORING METHOD THERFOF |
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