Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device

Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device

A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FUKUCHI RYO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FUKUCHI RYO
description A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017303405A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017303405A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017303405A13</originalsourceid><addsrcrecordid>eNqNjDEKwlAQRNNYiHqHBdsEolGsNRosFAQVy7D8bMxC_D-uG8FjewODWGih2MwwzMxre_fYVRUJJI5LH94C5E5gycciSITONVlzg5jF1KzNDkWYJJiqoikog0_Kj_YndoUntqjkw5q0cBm4HNZo6xyN1sL2CJtGtSEe-BlnDiXzAW329bEoyag4ywbmdGVDXa-VY3mh3ss7Xj9Z7OJlQJVL6VKhIUua7rfDcDCJwmgUjqeD6L_VA3iRcSI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device</title><source>esp@cenet</source><creator>FUKUCHI RYO</creator><creatorcontrib>FUKUCHI RYO</creatorcontrib><description>A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171019&amp;DB=EPODOC&amp;CC=US&amp;NR=2017303405A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171019&amp;DB=EPODOC&amp;CC=US&amp;NR=2017303405A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUCHI RYO</creatorcontrib><title>Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device</title><description>A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKwlAQRNNYiHqHBdsEolGsNRosFAQVy7D8bMxC_D-uG8FjewODWGih2MwwzMxre_fYVRUJJI5LH94C5E5gycciSITONVlzg5jF1KzNDkWYJJiqoikog0_Kj_YndoUntqjkw5q0cBm4HNZo6xyN1sL2CJtGtSEe-BlnDiXzAW329bEoyag4ywbmdGVDXa-VY3mh3ss7Xj9Z7OJlQJVL6VKhIUua7rfDcDCJwmgUjqeD6L_VA3iRcSI</recordid><startdate>20171019</startdate><enddate>20171019</enddate><creator>FUKUCHI RYO</creator><scope>EVB</scope></search><sort><creationdate>20171019</creationdate><title>Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device</title><author>FUKUCHI RYO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017303405A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUCHI RYO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUCHI RYO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device</title><date>2017-10-19</date><risdate>2017</risdate><abstract>A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2017303405A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
title Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T07%3A19%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUKUCHI%20RYO&rft.date=2017-10-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2017303405A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true