THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Al...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fischman Alex, Kettner Isaac Jak, Naigertsik Oleg, Engleman Ian
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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