SOLDER INSPECTION APPARATUS AND METHOD OF GENERATING FEEDBACK INFORMATION OF SOLDER INSPECTION APPARATUS

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support...

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Bibliographische Detailangaben
Hauptverfasser:	KIM Jeong Yeob, KIM Sa Woong
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES REGULATING STAMPS TRANSPORTING TYPEWRITERS
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