SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

A semiconductor memory device includes a first structural body, a second structural body and interconnections. The first and the second structural bodies are separated in a first direction and extend in a second direction. The interconnections are provided between the first structural body and the s...

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Hauptverfasser: MURAKOSHI Atsushi, SAKAIKE Kohei, KlKUTANI Keisuke, NAGASHIMA Satoshi, TAKEUCHI Shunichi, ARAI Fumitaka, SEKINE Katsuyuki, YAMAMOTO Katsumi, KATO Tatsuya
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creator MURAKOSHI Atsushi
SAKAIKE Kohei
KlKUTANI Keisuke
NAGASHIMA Satoshi
TAKEUCHI Shunichi
ARAI Fumitaka
SEKINE Katsuyuki
YAMAMOTO Katsumi
KATO Tatsuya
description A semiconductor memory device includes a first structural body, a second structural body and interconnections. The first and the second structural bodies are separated in a first direction and extend in a second direction. The interconnections are provided between the first structural body and the second structural body, extend in the second direction, and are separated from each other along a third direction. The first and the second structural bodies each includes an insulating member, a column-shaped body and an insulating film. The insulating member and the column-shaped body are disposed in an alternating manner along the second direction and extend in the third direction. The insulating members of the first and second structural bodies make contact with the interconnections.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
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