High-Pressure Card Locks For Maximizing Heat Transfer From Electronics Cards To Card Cages

Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink...

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Hauptverfasser: Osborne John W, Rozzi Jay C, Conboy Thomas M, Munro Christopher B, Kattamis Nicholas T
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Sprache:eng
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creator Osborne John W
Rozzi Jay C
Conboy Thomas M
Munro Christopher B
Kattamis Nicholas T
description Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017257966A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017257966A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017257966A13</originalsourceid><addsrcrecordid>eNqNjDEKwkAQAK-xEPUPC9YBEzHBUkJCCgXB2NiE5dzEw-Q27J4gvl5QH2A1zcxMzaVy3S06Cqk-hCBHucKe7V2hZIEDPt3gXs53UBEGqAW9tiRQCg9Q9GSDsHdWP6FCzd9Djh3p3Exa7JUWP87MsizqvIpo5IZ0REueQnM-Jas4SzbZNk138fo_6w0-4jpy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High-Pressure Card Locks For Maximizing Heat Transfer From Electronics Cards To Card Cages</title><source>esp@cenet</source><creator>Osborne John W ; Rozzi Jay C ; Conboy Thomas M ; Munro Christopher B ; Kattamis Nicholas T</creator><creatorcontrib>Osborne John W ; Rozzi Jay C ; Conboy Thomas M ; Munro Christopher B ; Kattamis Nicholas T</creatorcontrib><description>Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170907&amp;DB=EPODOC&amp;CC=US&amp;NR=2017257966A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170907&amp;DB=EPODOC&amp;CC=US&amp;NR=2017257966A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Osborne John W</creatorcontrib><creatorcontrib>Rozzi Jay C</creatorcontrib><creatorcontrib>Conboy Thomas M</creatorcontrib><creatorcontrib>Munro Christopher B</creatorcontrib><creatorcontrib>Kattamis Nicholas T</creatorcontrib><title>High-Pressure Card Locks For Maximizing Heat Transfer From Electronics Cards To Card Cages</title><description>Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKwkAQAK-xEPUPC9YBEzHBUkJCCgXB2NiE5dzEw-Q27J4gvl5QH2A1zcxMzaVy3S06Cqk-hCBHucKe7V2hZIEDPt3gXs53UBEGqAW9tiRQCg9Q9GSDsHdWP6FCzd9Djh3p3Exa7JUWP87MsizqvIpo5IZ0REueQnM-Jas4SzbZNk138fo_6w0-4jpy</recordid><startdate>20170907</startdate><enddate>20170907</enddate><creator>Osborne John W</creator><creator>Rozzi Jay C</creator><creator>Conboy Thomas M</creator><creator>Munro Christopher B</creator><creator>Kattamis Nicholas T</creator><scope>EVB</scope></search><sort><creationdate>20170907</creationdate><title>High-Pressure Card Locks For Maximizing Heat Transfer From Electronics Cards To Card Cages</title><author>Osborne John W ; Rozzi Jay C ; Conboy Thomas M ; Munro Christopher B ; Kattamis Nicholas T</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017257966A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Osborne John W</creatorcontrib><creatorcontrib>Rozzi Jay C</creatorcontrib><creatorcontrib>Conboy Thomas M</creatorcontrib><creatorcontrib>Munro Christopher B</creatorcontrib><creatorcontrib>Kattamis Nicholas T</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Osborne John W</au><au>Rozzi Jay C</au><au>Conboy Thomas M</au><au>Munro Christopher B</au><au>Kattamis Nicholas T</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-Pressure Card Locks For Maximizing Heat Transfer From Electronics Cards To Card Cages</title><date>2017-09-07</date><risdate>2017</risdate><abstract>Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title High-Pressure Card Locks For Maximizing Heat Transfer From Electronics Cards To Card Cages
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T00%3A19%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Osborne%20John%20W&rft.date=2017-09-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2017257966A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true