Method of Manufacturing Molded Semiconductor Packages Having an Optical Inspection Feature

A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads are also embedded in the mold compound and electric...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Soriano Aileen Manantan, Muhammat Sanusi Muhammad, Lee Swee Kah, Ng Mei Chin, Goh Soon Lock, Lum Fong Mei, Chong Hock Heng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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