ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

An electronic component built-in substrate includes a first core layer having opening, a second core layer formed on the first core layer, a third core layer formed on the second core layer and having opening, a first electronic component accommodated in the opening of the first core layer, a second...

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Bibliographische Detailangaben

Hauptverfasser:	WATANABE Hiroyuki, MANO Yasuhiko
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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