UNIVERSAL PROCESS KIT

The implementations described herein generally relate to a process kit suitable for use in a semiconductor process chamber, which reduces edge effects and widens the processing window with a single edge ring as compared to conventional process kits. The process kit generally includes an edge ring di...

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Hauptverfasser: JOUBERT Olivier, KENNEY Jason A, ROGERS James, DHINDSA Rajinder, ACHUTHARAMAN Vedapuram S, SRINIVASAN Sunil, LUERE Olivier
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creator JOUBERT Olivier
KENNEY Jason A
ROGERS James
DHINDSA Rajinder
ACHUTHARAMAN Vedapuram S
SRINIVASAN Sunil
LUERE Olivier
description The implementations described herein generally relate to a process kit suitable for use in a semiconductor process chamber, which reduces edge effects and widens the processing window with a single edge ring as compared to conventional process kits. The process kit generally includes an edge ring disposed adjacent to and surrounding a perimeter of a semiconductor substrate in a plasma chamber. A dimension of a gap between the substrate and the edge ring is less than about 1000 μm, and a height difference between the substrate and the edge ring is less than about (+/−) 300 μm. The resistivity of the ring is less than about 50 Ohm-cm.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title UNIVERSAL PROCESS KIT
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