PICK AND PLACE DEVICE COMPRISING PICK ARM CORRECTION MODULE
A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operabl...
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| creator | LAU Chung Yan LAM Kai Siu LAM Kui Kam ZHANG Zhuanyun WONG Nim Tak |
| description | A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location. |
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A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | PICK AND PLACE DEVICE COMPRISING PICK ARM CORRECTION MODULE |
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