VAPOR CHAMBER AMPLIFIER MODULE

In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-condu...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Xu Yongjie, Gu Qiyun, Brown Richard W, Patel Sammit A
Format:	Patent
Sprache:	eng
Schlagworte:	AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Xu Yongjie Gu Qiyun Brown Richard W Patel Sammit A
description	In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2017230011A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2017230011A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2017230011A13</originalsourceid><addsrcrecordid>eNrjZJALcwzwD1Jw9nD0dXINUnD0DfDxdPMEsnz9XUJ9XHkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBobmRsYGBoaGjoTFxqgAsFyIU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VAPOR CHAMBER AMPLIFIER MODULE</title><source>esp@cenet</source><creator>Xu Yongjie ; Gu Qiyun ; Brown Richard W ; Patel Sammit A</creator><creatorcontrib>Xu Yongjie ; Gu Qiyun ; Brown Richard W ; Patel Sammit A</creatorcontrib><description>In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.</description><language>eng</language><subject>AMPLIFIERS ; BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170810&DB=EPODOC&CC=US&NR=2017230011A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170810&DB=EPODOC&CC=US&NR=2017230011A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Xu Yongjie</creatorcontrib><creatorcontrib>Gu Qiyun</creatorcontrib><creatorcontrib>Brown Richard W</creatorcontrib><creatorcontrib>Patel Sammit A</creatorcontrib><title>VAPOR CHAMBER AMPLIFIER MODULE</title><description>In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.</description><subject>AMPLIFIERS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALcwzwD1Jw9nD0dXINUnD0DfDxdPMEsnz9XUJ9XHkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBobmRsYGBoaGjoTFxqgAsFyIU</recordid><startdate>20170810</startdate><enddate>20170810</enddate><creator>Xu Yongjie</creator><creator>Gu Qiyun</creator><creator>Brown Richard W</creator><creator>Patel Sammit A</creator><scope>EVB</scope></search><sort><creationdate>20170810</creationdate><title>VAPOR CHAMBER AMPLIFIER MODULE</title><author>Xu Yongjie ; Gu Qiyun ; Brown Richard W ; Patel Sammit A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2017230011A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2017</creationdate><topic>AMPLIFIERS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Xu Yongjie</creatorcontrib><creatorcontrib>Gu Qiyun</creatorcontrib><creatorcontrib>Brown Richard W</creatorcontrib><creatorcontrib>Patel Sammit A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Xu Yongjie</au><au>Gu Qiyun</au><au>Brown Richard W</au><au>Patel Sammit A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VAPOR CHAMBER AMPLIFIER MODULE</title><date>2017-08-10</date><risdate>2017</risdate><abstract>In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US2017230011A1
source	esp@cenet
subjects	AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	VAPOR CHAMBER AMPLIFIER MODULE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T21%3A44%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Xu%20Yongjie&rft.date=2017-08-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2017230011A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true